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SAMWON TECHNOLOGY Delivery Performance

Company Product year
SKIET CCS Aging Oven 2020
SKIET CCS Aging Oven 2019
Shirai Electronics Industrial Co.,Ltd Hot oil test chamber 2019
Fukushima Robot Test Field Decompression chamber 2019
Mitsubishi Electric Corporation Decompression chamber 2019
Japan Automotive Research Institute Large size thermal shock chamber 2019
ORIX Rentec Corporation Multi-environmental chamber 2018
GS Yuasa International Ltd. Multi-environmental chamber 2018
Dibea  Hast system 2018
Bando Chemical Industries, Ltd. Air to air thermal shock chamber 2018
FDK Energy Co., Ltd. Multi-environmental chamber 2018
ROKI Co., Ltd. Air to air thermal shock chamber 2018
Samsung(PSPC Philippines) Semiconductor chamber 2018
SL LUMAX LTD (India) Multifunctional chamber 2018
SIS Decompression (Altitude) chamber 2018
KPSCORP Constant Temperature Chamber 2018
Shimadzu Corporation Multi-environmental chamber 2017
Shinken Co. LTD. Liquid type thermal shock chamber 2017
Daicel Corporation Multi-environmental chamber 2017
Deson Corporation Hast system 2017
Jukawa Rubber Co., Ltd. Vacuum oven 2017
Fujikura Ltd. Multi-environmental chamber 2017
Fujita Corporation Liquid type thermal shock chamber 2017
Magnescale Co.,Ltd. Liquid type thermal shock chamber 2017
RICOH Multi-environmental chamber 2017
Renesas Electronics Air to air thermal shock chamber 2017
IHI Corporation Multifunctional chamber 2017
Kulthorn Premier Company Limited(Thailand) Liquid type thermal shock chamber 2017
Texas Instruments(Philippines) Semiconductor chamber 2017
AMCO(Philippines) Multifunctional chamber 2017
Wonju Medical Industry Center Air to air thermal shock chamber 2017
Hitachi Global Storage Technologies Air to air thermal shock chamber 2016
FUJI INDUSTRIES CO.,LTD Air to air thermal shock chamber 2016
FUJI Microelectronics Co., Ltd Multifunctional chamber 2016
Fuji Electric Equipment Control Co., Ltd. Liquid type thermal shock chamber 2016
Fuji Film Co., Ltd. Air to air thermal shock chamber 2016
Furukawa-Sky Aluminium Corporation Multifunctional chamber 2016
Mitsubishi Heavy Industries Co., Ltd. Multi-environmental chamber 2016
Mitsubishi Electric Corporation Bench-top temp. & humi. chamber 2016
Mitsuboshi Belting Ltd. Liquid type thermal shock chamber 2016
Yazaki Instruments Co., Ltd. Multifunctional chamber 2016
Koito Manufacturing Co., Ltd. Multi-environmental chamber 2016
Samsung R&D Institute Japan-Yokohama. Semiconductor chamber 2016
Renesas Semiconductor Malaysia Decompression (Altitude) chamber 2016
RECREATION CO., LTD.(Malaysia) Multifunctional chamber 2016
Hitachi(Thailand) Semiconductor chamber 2016
SIAM COMPRESSOR INDUSTRY(Thailand) Multifunctional chamber 2016
NIA Decompression (Altitude) chamber 2016
SK Innovation CO., LTD. CCS Slitter Oven 2016
Kaneka Corporation Hast system 2015
Kaoru Tech Bench-top temp. & humi. chamber 2015
Japan tobacco industry Multi-environmental chamber 2015
Japan filler industry Air to air thermal shock chamber 2015
Pioneer Corporation Air to air thermal shock chamber 2015
Panasonic Energy Bench-top temp. & humi. chamber 2015
Panasonic Electro Devices Co., Ltd. Liquid type thermal shock chamber 2015
anasonic Electric Works Co., Ltd. Semiconductor chamber 2015
Hitachi Automotive Systems Ltd. Semiconductor chamber 2015
Hitachi Electric Wire Co., Ltd. Bench-top temp. & humi. chamber 2015
MXIC(Taiwan) Air to air thermal shock chamber 2015
ASE(Taiwan) Air to air thermal shock chamber 2015
ETORN(Taiwan) Multi-environmental chamber 2015
UNIMICRON(Taiwan) Multi-environmental chamber 2015
HSL(Korea) Multifunctional chamber 2015
KEMTI Multifunctional chamber 2015
SK Energy Air to air thermal shock chamber 2015
Daikin Industry Co., Ltd. Decompression (Altitude) chamber 2014
Terumo Corporation Air to air thermal shock chamber 2014
Tokai Rubber Industry Co., Ltd. Air to air thermal shock chamber 2014
Toho Kasei Co., Ltd. Hast system 2014
Toyo Aluminium K.K. Liquid type thermal shock chamber 2014
TOYOKI INDUSTRIAL CO., LTD. Decompression (Altitude) chamber 2014
Nabtesco Corporation Multifunctional chamber 2014
Nitta Corporation Hast system 2014
NIPPON AVIONICS CO.,LTD. Multi-environmental chamber 2014
HANSTAR(Taiwan) Liquid crystal test chamber 2014
MOSEL(Taiwan) Decompression (Altitude) chamber 2014
Texas Instruments(Taiwan) Semiconductor chamber 2014
SIMTEC Air to air thermal shock chamber 2014
Daewoo Electronics Air to air thermal shock chamber 2014
Korea Electrotechnology Research Institute  Decompression (Altitude) chamber 2014
SK Innovation CO., LTD. Vacuum Dry Oven 2014
Bando Chemical Industries, Ltd. Vacuum oven 2013
FDK Energy Co., Ltd. Hast system 2013
ROKI Co., Ltd. Air to air thermal shock chamber 2013
Suzuki Decompression (Altitude) chamber 2013
Sumika Bayer Urethane Co., Ltd. Multi-environmental chamber 2013
Sumitomo Becklite Co., Ltd. Liquid type thermal shock chamber 2013
3M HEALTH CARE  Multi-environmental chamber 2013
TANKEN SEAL SEIKO CO., LTD. Liquid type thermal shock chamber 2013
Seiko Chemicals Co., Ltd. Hast system 2013
Hong Kong University of Science and Technology Air to air thermal shock chamber 2013
QDI(Taiwan) Multi-environmental chamber 2013
COMPEQ(Taiwan) Multi-environmental chamber 2013
WALSIN(Taiwan) Multi-environmental chamber 2013
SONY(Korea) Air to air thermal shock chamber 2013
Samsung Electro-mechanics Co., Ltd. Semiconductor chamber 2013
Samsung Electronics Co., Ltd. Semiconductor chamber 2013
SK Innovation CO., LTD. Vacuum Drier 2013
Deson Corporation Multi-environmental chamber 2012
Jukawa Rubber Co., Ltd. Liquid type thermal shock chamber 2012
Fujikura Ltd. Air to air thermal shock chamber 2012
Fujita Corporation Multifunctional chamber 2012
Magnescale Co.,Ltd. Multi-environmental chamber 2012
RICOH Multi-environmental chamber 2012
Renesas Electronics Multifunctional chamber 2012
IHI Corporation Air to air thermal shock chamber 2012
ORIX Rentec Corporation Multifunctional chamber 2012
GS Yuasa International Ltd. Liquid type thermal shock chamber 2012
Dibea  Multi-environmental chamber 2012
SESS(Suzhou Samsung Electronics) Multifunctional chamber 2012
China Nanjing Panda Co., Ltd. Liquid crystal test chamber 2012
Nanjing Sharp Co., Ltd. Liquid crystal test chamber 2012
ASAT(Hong Kong) Liquid type thermal shock chamber 2012
Hong Kong Sung Si University Air to air thermal shock chamber 2012
LG Electronics Inc. Air to air thermal shock chamber 2012
STATS ChipPAC Korea Ltd. Semiconductor chamber 2012
Sk energy Vacuum Dry Oven 2012
Sharp Corporation Liquid crystal test chamber 2011
Sumitomo Precision Industries Co., Ltd. Multi-environmental chamber 2011
Sumitomo Heavy Industries, Ltd. Air to air thermal shock chamber 2011
Sumitomo Electric Industries Co., Ltd. Air to air thermal shock chamber 2011
IMV Corporation Air to air thermal shock chamber 2011
NOK Corporation Air to air thermal shock chamber 2011
Samsung R&D Institute Japan-Yokohama. Multi-environmental chamber 2011
Shimadzu Corporation Liquid type thermal shock chamber 2011
Shinken Co. LTD. Liquid type thermal shock chamber 2011
Daicel Corporation Multi-environmental chamber 2011
Samyang Electric (Shenyang, Qingdao, Dalian) Multi-environmental chamber 2011
Morex (Shanghai) Liquid type thermal shock chamber 2011
ASAT (Dongguan) Liquid type thermal shock chamber 2011
Seiko Instruments (Guangzhou) Multi-environmental chamber 2011
ASE(Shanghai) Semiconductor chamber 2011
Alpine Multi-environmental chamber 2011
HOYA(Vietnam) Anneal Oven 2011
HOYA(Thailand) Polymerization Oven 2011
ITES Co., Ltd. Liquid type thermal shock chamber 2010
AISHIN CORPORATION Multifunctional chamber 2010
Acray Co., Ltd. Multifunctional chamber 2010
Asmo Corporation Air to air thermal shock chamber 2010
Alps Electric Co., Ltd. Bench-top temp. & humi. chamber 2010
Ito Corporation Liquid type thermal shock chamber 2010
Osaka Gas Co., Ltd. Multi-environmental chamber 2010
Casio Corporation Bench-top temp. & humi. chamber 2010
Kaneka Corporation Air to air thermal shock chamber 2010
Kyocera Corporation Liquid crystal test chamber 2010
Sawa Fuji Electric Co., Ltd. Decompression (Altitude) chamber 2010
Sanyo Electric Co., Ltd. Bench-top temp. & humi. chamber 2010
Shizuki Electric Corporation Decompression (Altitude) chamber 2010