SKIET |
CCS Aging Oven |
2020 |
SKIET |
CCS Aging Oven |
2019 |
Shirai Electronics Industrial Co.,Ltd |
Hot oil test chamber |
2019 |
Fukushima Robot Test Field |
Decompression chamber |
2019 |
Mitsubishi Electric Corporation |
Decompression chamber |
2019 |
Japan Automotive Research Institute |
Large size thermal shock chamber |
2019 |
ORIX Rentec Corporation |
Multi-environmental chamber |
2018 |
GS Yuasa International Ltd. |
Multi-environmental chamber |
2018 |
Dibea |
Hast system |
2018 |
Bando Chemical Industries, Ltd. |
Air to air thermal shock chamber |
2018 |
FDK Energy Co., Ltd. |
Multi-environmental chamber |
2018 |
ROKI Co., Ltd. |
Air to air thermal shock chamber |
2018 |
Samsung(PSPC Philippines) |
Semiconductor chamber |
2018 |
SL LUMAX LTD (India) |
Multifunctional chamber |
2018 |
SIS |
Decompression (Altitude) chamber |
2018 |
KPSCORP |
Constant Temperature Chamber |
2018 |
Shimadzu Corporation |
Multi-environmental chamber |
2017 |
Shinken Co. LTD. |
Liquid type thermal shock chamber |
2017 |
Daicel Corporation |
Multi-environmental chamber |
2017 |
Deson Corporation |
Hast system |
2017 |
Jukawa Rubber Co., Ltd. |
Vacuum oven |
2017 |
Fujikura Ltd. |
Multi-environmental chamber |
2017 |
Fujita Corporation |
Liquid type thermal shock chamber |
2017 |
Magnescale Co.,Ltd. |
Liquid type thermal shock chamber |
2017 |
RICOH |
Multi-environmental chamber |
2017 |
Renesas Electronics |
Air to air thermal shock chamber |
2017 |
IHI Corporation |
Multifunctional chamber |
2017 |
Kulthorn Premier Company Limited(Thailand) |
Liquid type thermal shock chamber |
2017 |
Texas Instruments(Philippines) |
Semiconductor chamber |
2017 |
AMCO(Philippines) |
Multifunctional chamber |
2017 |
Wonju Medical Industry Center |
Air to air thermal shock chamber |
2017 |
Hitachi Global Storage Technologies |
Air to air thermal shock chamber |
2016 |
FUJI INDUSTRIES CO.,LTD |
Air to air thermal shock chamber |
2016 |
FUJI Microelectronics Co., Ltd |
Multifunctional chamber |
2016 |
Fuji Electric Equipment Control Co., Ltd. |
Liquid type thermal shock chamber |
2016 |
Fuji Film Co., Ltd. |
Air to air thermal shock chamber |
2016 |
Furukawa-Sky Aluminium Corporation |
Multifunctional chamber |
2016 |
Mitsubishi Heavy Industries Co., Ltd. |
Multi-environmental chamber |
2016 |
Mitsubishi Electric Corporation |
Bench-top temp. & humi. chamber |
2016 |
Mitsuboshi Belting Ltd. |
Liquid type thermal shock chamber |
2016 |
Yazaki Instruments Co., Ltd. |
Multifunctional chamber |
2016 |
Koito Manufacturing Co., Ltd. |
Multi-environmental chamber |
2016 |
Samsung R&D Institute Japan-Yokohama. |
Semiconductor chamber |
2016 |
Renesas Semiconductor Malaysia |
Decompression (Altitude) chamber |
2016 |
RECREATION CO., LTD.(Malaysia) |
Multifunctional chamber |
2016 |
Hitachi(Thailand) |
Semiconductor chamber |
2016 |
SIAM COMPRESSOR INDUSTRY(Thailand) |
Multifunctional chamber |
2016 |
NIA |
Decompression (Altitude) chamber |
2016 |
SK Innovation CO., LTD. |
CCS Slitter Oven |
2016 |
Kaneka Corporation |
Hast system |
2015 |
Kaoru Tech |
Bench-top temp. & humi. chamber |
2015 |
Japan tobacco industry |
Multi-environmental chamber |
2015 |
Japan filler industry |
Air to air thermal shock chamber |
2015 |
Pioneer Corporation |
Air to air thermal shock chamber |
2015 |
Panasonic Energy |
Bench-top temp. & humi. chamber |
2015 |
Panasonic Electro Devices Co., Ltd. |
Liquid type thermal shock chamber |
2015 |
anasonic Electric Works Co., Ltd. |
Semiconductor chamber |
2015 |
Hitachi Automotive Systems Ltd. |
Semiconductor chamber |
2015 |
Hitachi Electric Wire Co., Ltd. |
Bench-top temp. & humi. chamber |
2015 |
MXIC(Taiwan) |
Air to air thermal shock chamber |
2015 |
ASE(Taiwan) |
Air to air thermal shock chamber |
2015 |
ETORN(Taiwan) |
Multi-environmental chamber |
2015 |
UNIMICRON(Taiwan) |
Multi-environmental chamber |
2015 |
HSL(Korea) |
Multifunctional chamber |
2015 |
KEMTI |
Multifunctional chamber |
2015 |
SK Energy |
Air to air thermal shock chamber |
2015 |
Daikin Industry Co., Ltd. |
Decompression (Altitude) chamber |
2014 |
Terumo Corporation |
Air to air thermal shock chamber |
2014 |
Tokai Rubber Industry Co., Ltd. |
Air to air thermal shock chamber |
2014 |
Toho Kasei Co., Ltd. |
Hast system |
2014 |
Toyo Aluminium K.K. |
Liquid type thermal shock chamber |
2014 |
TOYOKI INDUSTRIAL CO., LTD. |
Decompression (Altitude) chamber |
2014 |
Nabtesco Corporation |
Multifunctional chamber |
2014 |
Nitta Corporation |
Hast system |
2014 |
NIPPON AVIONICS CO.,LTD. |
Multi-environmental chamber |
2014 |
HANSTAR(Taiwan) |
Liquid crystal test chamber |
2014 |
MOSEL(Taiwan) |
Decompression (Altitude) chamber |
2014 |
Texas Instruments(Taiwan) |
Semiconductor chamber |
2014 |
SIMTEC |
Air to air thermal shock chamber |
2014 |
Daewoo Electronics |
Air to air thermal shock chamber |
2014 |
Korea Electrotechnology Research Institute |
Decompression (Altitude) chamber |
2014 |
SK Innovation CO., LTD. |
Vacuum Dry Oven |
2014 |
Bando Chemical Industries, Ltd. |
Vacuum oven |
2013 |
FDK Energy Co., Ltd. |
Hast system |
2013 |
ROKI Co., Ltd. |
Air to air thermal shock chamber |
2013 |
Suzuki |
Decompression (Altitude) chamber |
2013 |
Sumika Bayer Urethane Co., Ltd. |
Multi-environmental chamber |
2013 |
Sumitomo Becklite Co., Ltd. |
Liquid type thermal shock chamber |
2013 |
3M HEALTH CARE |
Multi-environmental chamber |
2013 |
TANKEN SEAL SEIKO CO., LTD. |
Liquid type thermal shock chamber |
2013 |
Seiko Chemicals Co., Ltd. |
Hast system |
2013 |
Hong Kong University of Science and Technology |
Air to air thermal shock chamber |
2013 |
QDI(Taiwan) |
Multi-environmental chamber |
2013 |
COMPEQ(Taiwan) |
Multi-environmental chamber |
2013 |
WALSIN(Taiwan) |
Multi-environmental chamber |
2013 |
SONY(Korea) |
Air to air thermal shock chamber |
2013 |
Samsung Electro-mechanics Co., Ltd. |
Semiconductor chamber |
2013 |
Samsung Electronics Co., Ltd. |
Semiconductor chamber |
2013 |
SK Innovation CO., LTD. |
Vacuum Drier |
2013 |
Deson Corporation |
Multi-environmental chamber |
2012 |
Jukawa Rubber Co., Ltd. |
Liquid type thermal shock chamber |
2012 |
Fujikura Ltd. |
Air to air thermal shock chamber |
2012 |
Fujita Corporation |
Multifunctional chamber |
2012 |
Magnescale Co.,Ltd. |
Multi-environmental chamber |
2012 |
RICOH |
Multi-environmental chamber |
2012 |
Renesas Electronics |
Multifunctional chamber |
2012 |
IHI Corporation |
Air to air thermal shock chamber |
2012 |
ORIX Rentec Corporation |
Multifunctional chamber |
2012 |
GS Yuasa International Ltd. |
Liquid type thermal shock chamber |
2012 |
Dibea |
Multi-environmental chamber |
2012 |
SESS(Suzhou Samsung Electronics) |
Multifunctional chamber |
2012 |
China Nanjing Panda Co., Ltd. |
Liquid crystal test chamber |
2012 |
Nanjing Sharp Co., Ltd. |
Liquid crystal test chamber |
2012 |
ASAT(Hong Kong) |
Liquid type thermal shock chamber |
2012 |
Hong Kong Sung Si University |
Air to air thermal shock chamber |
2012 |
LG Electronics Inc. |
Air to air thermal shock chamber |
2012 |
STATS ChipPAC Korea Ltd. |
Semiconductor chamber |
2012 |
Sk energy |
Vacuum Dry Oven |
2012 |
Sharp Corporation |
Liquid crystal test chamber |
2011 |
Sumitomo Precision Industries Co., Ltd. |
Multi-environmental chamber |
2011 |
Sumitomo Heavy Industries, Ltd. |
Air to air thermal shock chamber |
2011 |
Sumitomo Electric Industries Co., Ltd. |
Air to air thermal shock chamber |
2011 |
IMV Corporation |
Air to air thermal shock chamber |
2011 |
NOK Corporation |
Air to air thermal shock chamber |
2011 |
Samsung R&D Institute Japan-Yokohama. |
Multi-environmental chamber |
2011 |
Shimadzu Corporation |
Liquid type thermal shock chamber |
2011 |
Shinken Co. LTD. |
Liquid type thermal shock chamber |
2011 |
Daicel Corporation |
Multi-environmental chamber |
2011 |
Samyang Electric (Shenyang, Qingdao, Dalian) |
Multi-environmental chamber |
2011 |
Morex (Shanghai) |
Liquid type thermal shock chamber |
2011 |
ASAT (Dongguan) |
Liquid type thermal shock chamber |
2011 |
Seiko Instruments (Guangzhou) |
Multi-environmental chamber |
2011 |
ASE(Shanghai) |
Semiconductor chamber |
2011 |
Alpine |
Multi-environmental chamber |
2011 |
HOYA(Vietnam) |
Anneal Oven |
2011 |
HOYA(Thailand) |
Polymerization Oven |
2011 |
ITES Co., Ltd. |
Liquid type thermal shock chamber |
2010 |
AISHIN CORPORATION |
Multifunctional chamber |
2010 |
Acray Co., Ltd. |
Multifunctional chamber |
2010 |
Asmo Corporation |
Air to air thermal shock chamber |
2010 |
Alps Electric Co., Ltd. |
Bench-top temp. & humi. chamber |
2010 |
Ito Corporation |
Liquid type thermal shock chamber |
2010 |
Osaka Gas Co., Ltd. |
Multi-environmental chamber |
2010 |
Casio Corporation |
Bench-top temp. & humi. chamber |
2010 |
Kaneka Corporation |
Air to air thermal shock chamber |
2010 |
Kyocera Corporation |
Liquid crystal test chamber |
2010 |
Sawa Fuji Electric Co., Ltd. |
Decompression (Altitude) chamber |
2010 |
Sanyo Electric Co., Ltd. |
Bench-top temp. & humi. chamber |
2010 |
Shizuki Electric Corporation |
Decompression (Altitude) chamber |
2010 |